Chromasens 3DPIXA – The 2-in-1 3D Camera You Need!


This application note describes the use of the Chromasens 3DPIXA compact camera to produce 2D and 3D images. 

Problem Statement

Chipsets are generally very small, as the height of one averages at around 0.5mm. However, the problem lies when a user faces difficulty finding a chipset that overlapped during production or cosmetic defect inspection. 

Although using a 2D area scan camera would be useful for cosmetic defect inspections, it may be unsuitable for identifying stacked chipsets, since it would be undetected. Likewise, using a 3D camera would be useful for detecting overlapped chipsets, but it may not be able to identify scratches on the chips. 

Moreover, if a user has a limited and compact working space for the inspection process, utilising both a 2D and a 3D camera would be inefficient in terms of space and cost.


Figure 1: Rough sketch of Chromasens 3DPIXA compact 15µm camera setup and Chromasens Corona II Tube Light (Not drawn to scale)

Figure 2: Depth map image using Chromasens 3DPIXA compact camera (Green and yellow colour: height of chipsets are aligned, with an error of ± 0.1mm; Orange colour: overlapping chipsets/height of chipsets are not aligned

With these requirements, the Chromasens 3DPIXA compact 15µm camera would be the most suitable for this application as the camera can provide both a 2D colour image and a 3D point cloud or depth map. The camera is also able to detect overlapped or not aligned chipsets, as it will show different colours on the depth map based on the height differences. Additionally, the 3D camera is able to capture precise images at a high speed of up to 310mm/s.

The Chromasens 3DPIXA compact 15µm camera is able to provide high accuracy 2D colour images as it is equipped with a Tri-linear CCD Sensor (RGB) and provides an accuracy of up to 15 µm/pixel. This allows users to check for defects, such as scratches or dents, or conduct further OCR (Optical Character Recognition) on the chipsets.

This application also uses the Chromasens Corona II Tube Light, which helps to produce a soft, diffused light from all directions, illuminating all sides of the chipsets. When used together with the Chromasens 3DPIXA compact 15µm camera, the setup is suitable for detecting object defects that require height information (z-coordinate). 

This includes applications such as PCB inspections, wire bond inspections, or metal surface inspections. Lastly, using Chromasens 3DPIXA would be most efficient for a user with limited working space for the inspection process, as it saves space and cost.

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